1. A method for mounting an electronic component having a plurality of board insert type leads on a board, the method comprising:a providing process which provides a chuck unit including a fixed chuck member having a grip part and a movable chuck member having a grip part opposed to the grip part of the fixed chuck member;
a holding process which chucks only one of the plurality of leads of the electronic component by the chuck unit by moving the movable chuck member toward the fixed chuck member while the fixed chuck member is fixed, wherein any other ones of the plurality of leads of the electronic component are not chucked by the chuck unit in the holding process; and
an inserting process which inserts the leads of the electronic component held in the holding process respectively into lead insert holes provided in the board,
wherein the holding process comprises positioning one of the leads between the grip part of the movable chuck member and the grip part of the fixed chuck member, and chucking the one of the leads by moving the grip part of the movable chuck member toward the grip part of the fixed chuck member.