US Patent No. 9,992,912

HEAT DISSIPATING DEVICE COMBINED STRUCTURE


Patent No. 9,992,912
Issue Date June 05, 2018
Title Heat Dissipating Device Combined Structure
Inventorship Chun-Chieh Wang, Taipei (TW)
Assignee LIANCHUN INDUSTRIAL CO., LTD., New Taipei (TW)

Claim of US Patent No. 9,992,912

1. A heat dissipating device combined structure, comprising: a heat sink, the heat sink is provided with a bottom portion, a plurality of heat dissipating fins extend from the surface of the bottom portion, and at least one expanded portion extends from each side of the bottom portion; a clasp member, the clasp member is provided with a base, a side perpendicularly extends from the two sides of the base, a conduit is formed between the two sides, and the conduit enables the heat sink and a circuit board to be disposed therein; at least one ledge portion is configured on each of the sides, and the ledge portions pair with the bottom surface of the circuit board, a plurality of air foils extend from one end of the sides, and a slanting portion extends from each of the air foils to clasp onto the expanded portions; the bottom portion of the heat sink is attached to at least one exothermic electronic component on the top surface of the circuit board, and the circuit board is rigidly fixed between the slanting portions and the ledge portions; and wherein the circuit board and the heat sink are disposed and fixed inside the conduit; the width between the two expanded portions and the width of the circuit board are identical to the width of the conduit and the length of the circuit board is greater than the length of the clasp member; the protruding areas of the circuit board are respectively configured with a plurality of electrical contacts and at least one fixing hole, respectively.