US Patent No. 9,992,911


Patent No. 9,992,911
Issue Date June 05, 2018
Title Controllable Conductance Thermal Interface
Inventorship Clint G. Buckman, Torrance, CA (US)
Alex Chov, Simi Valley, CA (US)
Matthew Kim, Los Angeles, CA (US)
Hamahito Hokyo, Santa Barbara, CA (US)
Vinh Tran, San Jose, CA (US)
David Bothman, Santa Barbara, CA (US)
Assignee Northrop Grumman Systems Corporation, Falls Church, VA (US)

Claim of US Patent No. 9,992,911

1. A thermal transfer system for controlling a temperature of an electronic device, said system comprising:a thermally conductive device to which the electronic device is coupled;
a heat sink;
a thermal rail mounted to the heat sink; and
at least one shape memory alloy (SMA) element positioned in contact with the rail and the thermally conductive device, said at least one SMA element being shaped in a deformed configuration, and attempting to return to an undeformed configuration when the at least one SMA element is heated above a transition temperature so as to increase heat transfer between the thermally conductive device and the rail.