US Patent No. 9,992,880

RIGID-BEND PRINTED CIRCUIT BOARD FABRICATION


Patent No. 9,992,880
Issue Date June 05, 2018
Title Rigid-bend Printed Circuit Board Fabrication
Inventorship Pui Yin Yu, Tsuen Wan (HK)
Mark Zhang, Guangdong (CN)
Jiawen Chen, Guangdong (CN)
Assignee Multek Technologies Limited, San Jose, CA (US)

Claim of US Patent No. 9,992,880

1. A method of manufacturing a printed circuit board comprising:a. forming core structure having core circuitry on at least one surface of the core structure;
b. forming a printed circuit board stack up, wherein the printed circuit board stack up comprises the core structure, a dummy core, one or more non-conductive layers and one or more conductive layers, wherein one of the non-conductive layers is positioned between the dummy core and the core circuitry, further wherein the dummy core comprises a non-conductive layer and a conductive layer, and forming the printed circuit board stack up further comprises positioning the conductive layer of the dummy core in contact with the one non-conductive layer stacked in contact with the core circuitry;
c. laminating the printed circuit board stack up, thereby forming a laminated stack;
d. forming a depth controlled rout from a surface of the laminated stack to the dummy core and around a perimeter of the dummy core, wherein a portion of the laminated stack within the perimeter of the rout and to a depth including the dummy core forms a laminated stack plug; and
e. removing the laminated stack plug, thereby exposing the one non-conductive layer positioned between the dummy core and the core circuitry, wherein the exposed non-conductive layer has an exposed surface that is smooth.