1. A method of manufacturing a printed circuit board comprising:a. forming core structure having core circuitry on at least one surface of the core structure;
b. forming a printed circuit board stack up, wherein the printed circuit board stack up comprises the core structure, a dummy core, one or more non-conductive layers and one or more conductive layers, wherein one of the non-conductive layers is positioned between the dummy core and the core circuitry, further wherein the dummy core comprises a non-conductive layer and a conductive layer, and forming the printed circuit board stack up further comprises positioning the conductive layer of the dummy core in contact with the one non-conductive layer stacked in contact with the core circuitry;
c. laminating the printed circuit board stack up, thereby forming a laminated stack;
d. forming a depth controlled rout from a surface of the laminated stack to the dummy core and around a perimeter of the dummy core, wherein a portion of the laminated stack within the perimeter of the rout and to a depth including the dummy core forms a laminated stack plug; and
e. removing the laminated stack plug, thereby exposing the one non-conductive layer positioned between the dummy core and the core circuitry, wherein the exposed non-conductive layer has an exposed surface that is smooth.