US Patent No. 9,992,879

PACKAGE SUBSTRATE WITH METAL ON CONDUCTIVE PORTIONS AND MANUFACTURING METHOD THEREOF


Patent No. 9,992,879
Issue Date June 05, 2018
Title Package Substrate With Metal On Conductive Portions And Manufacturing Method Thereof
Inventorship Che-Wei Hsu, Hsinchu County (TW)
Shih-Ping Hsu, Hsinchu County (TW)
Pao-Hung Chou, Hsinchu County (TW)
Assignee Phoenix Pioneer technology Co., Ltd., Hsinchu County (TW)

Claim of US Patent No. 9,992,879

1. A package substrate, comprising:a first dielectric layer having a first surface, a second surface opposite to the first surface, a plurality of openings through the first and second surfaces, and a wall surface facing at least one of the openings;
a first wiring layer located on the first surface and the wall surface, wherein a portion of the first wiring layer on an edge of the wall surface adjacent to the second surface extends in a direction away from the wall surface, and a portion of the first dielectric layer is free from coverage by the first wiring layer;
a first conductive pillar layer located on the first wiring layer that is on the first surface;
a second dielectric layer located on the first surface, the first wiring layer, and in the openings, and in contact with the portion of the first dielectric layer, wherein the first conductive pillar layer is exposed from the second dielectric layer, and a portion of the second dielectric layer is between the portion of the first wiring layer and the first dielectric layer, and a bottom surface of the portion of the second dielectric layer is flush with a bottom surface of the portion of the first wiring layer;
a second wiring layer located on the exposed first conductive pillar layer and the second dielectric layer;
an electrical pad layer located on the second wiring layer; and
a third dielectric layer located on the second dielectric layer and the second wiring layer, wherein the electrical pad layer is exposed from the third dielectric layer.