1. A method comprising:laminating a film over a plurality of light emitting diodes (LEDs) disposed on a mount by mounting the film over the plurality of LEDs and applying a heat of a first temperature under a pressure, such that the film covers the LEDs and adheres to the mount in areas between neighboring LEDs and forms a laminated structure;
cooling the laminated structure;
applying heat of a second temperature to the laminated structure in a vacuum, the second temperature being higher than the first temperature; and
after applying the heat of the second temperature to the laminated structure in the vacuum, reducing a thickness of a portion of the film disposed over top surfaces of the plurality of LEDs by pressing a flattening element against the top surfaces of the plurality of LEDs while applying heat of a third temperature that is the same as or different than the first temperature.