1. A semiconductor package comprising:a housing having a first side;
a second side opposite the first side;
a third side extending at an angle from the first side toward the second side;
an interior portion configured for housing a semiconductor device formed on a semiconductor substrate;
a first projection portion of the first side extending from the first side a first distance past the third side;
a second projection portion of the second side extending from the second side a second distance past the third side; and
a first attachment clip having a first end attached to the first projection portion and a second end attached to the second projection portion and having a main portion that extends between the first and second ends wherein the first end and the second end are substantially co-planar to the main portion; and
a loop in the main portion of the first attachment clip, the loop having a first portion extending from proximal to a central region of the main portion upwardly from the main portion and out of a plane of the main portion, the loop having a second portion extending from distal to the central region of the main portion and out of a plane of the main portion toward the first portion of the loop.