1. A method of manufacturing an interposer, comprising:forming a substrate having a first surface and a second surface substantially parallel to but opposite said first surface, said substrate having an opening formed therein at the first surface and communicatively coupling said first and second surfaces;
forming an electrically conductive material within said opening to thereby electrically connect regions on said first and second surfaces;
forming a microspring over said substrate, at least a first portion of said microspring formed to be in electrical communication with said conductive material formed within said opening;
releasing a free portion of said microspring such that said free portion assumes a non-planar profile, in the absence of an external force applied thereto, and is free to deflect over said substrate, at least a second portion of said microspring remaining in electrical communication with said conductive material;
forming a laminate structure over said substrate such that said microspring is at least partially embedded within said laminate structure; and
processing said substrate such that a portion of material is removed at the second surface such that said conductive material is exposed for electrical contact at said second surface of said substrate to thereby provide electrical contact to said microspring from said second surface of said substrate.