1. A multi-layer laser diode mount comprising:a submount having one surface supporting a diode laser;
a heatsink spaced from and facing a surface of the submount opposite the one surface, the submount and heatsink being configured with respective thermal expansion coefficients (TEC) differing from one another;
a metal layer deposited over and in contact with the opposite surface of the submount; and
a soft solder layer bonded to the metal layer and coupled to the heatsink so that a temperature of a p-n junction of the diode laser remains substantially constant through a predetermined amount of repeated thermo-cycles of up to at least several hundred cycles with a temperature differential ?T within each cycle exceeding one hundred ° C.