US Patent No. 9,935,422

HIGH-POWER LASER DIODE PACKAGING METHOD AND LASER DIODE MODULE


Patent No. 9,935,422
Issue Date April 03, 2018
Title High-power Laser Diode Packaging Method And Laser Diode Module
Inventorship Alexey Komissarov, Charlton, MA (US)
Dmitriy Miftakhutdinov, Worcester, MA (US)
Pavel Trubenko, Westborough, MA (US)
Igor Berishev, Southborough, MA (US)
Nikolai Strougov, Dudley, MA (US)
Assignee IPG PHOTONICS CORPORATION, Oxford, MA (US)

Claim of US Patent No. 9,935,422

1. A multi-layer laser diode mount comprising:a submount having one surface supporting a diode laser;
a heatsink spaced from and facing a surface of the submount opposite the one surface, the submount and heatsink being configured with respective thermal expansion coefficients (“TEC”) differing from one another;
a metal layer deposited over and in contact with the opposite surface of the submount; and
a soft solder layer bonded to the metal layer and coupled to the heatsink so that a temperature of a p-n junction of the diode laser remains substantially constant through a predetermined amount of repeated thermo-cycles of up to at least several hundred cycles with a temperature differential ?T within each cycle exceeding one hundred ° C.