US Patent No. 9,907,216

APPARATUS WITH DIRECT COOLING PATHWAY FOR COOLING BOTH SIDES OF POWER SEMICONDUCTOR


Patent No. 9,907,216
Issue Date February 27, 2018
Title Apparatus With Direct Cooling Pathway For Cooling Both Sides Of Power Semiconductor
Inventorship Young Seop Park, Yongin-si (KR)
Assignee HYUNDAI MOBIS Co., Ltd., Yongin-si (KR)

Claim of US Patent No. 9,907,216

1. An apparatus with a direct cooling pathway for cooling both sides of each of a plurality of power semiconductors, the apparatus
comprising:
a plurality of cooling segments, each of the cooling segments including an upper box having an open bottom surface facing
a top surface of a corresponding one of the power semiconductors and adhered to the top surface of the corresponding one of
the power semiconductors, and a lower box having an open top surface facing a bottom surface of the corresponding one of the
power semiconductors and adhered to the bottom surface of the corresponding one of the power semiconductors;

an inlet tank connected to an end portion of one side of the upper box of a first one of the cooling segments and configured
to allow fluid to be introduced and pass therethrough, and into which the fluid is introduced;

an outlet tank connected to an end portion of one side of the lower box of the first one of the cooling segments and configured
to allow the fluid to pass therethrough and be discharged; and

a connection tank connected to an end portion of another side of each of the upper box and the lower box of a second one of
the cooling segments and configured to allow the fluid to pass therethrough,

wherein immediately neighboring two of the plurality of cooling segments are connected to each other, a direct cooling pathway
is formed between the inlet tank and the connection tank, and between the outlet tank and the connection tank such that the
fluid comes into direct contact with the top surface and the bottom surface of each of the power semiconductors and cools
each of the power semiconductors.