US Patent No. 9,907,212

MODULAR HIGH-RISE DATA CENTERS AND METHODS THEREOF


Patent No. 9,907,212
Issue Date February 27, 2018
Title Modular High-rise Data Centers And Methods Thereof
Inventorship Marc Parizeau, Quebec (CA)
Eric Mateu-Huon, Montreal (CA)
Assignee VERT.COM INC, Montreal (CA)

Claim of US Patent No. 9,907,212

1. A modular data center comprising at least one data center slice, each of the at least one data center slice comprising
a plurality of stackable modules being vertically stacked, the plurality of stackable modules comprising:
a plurality of stackable data center IT modules being vertically stacked, each of the stackable data center IT modules comprising:
a first IT area allowing air to flow downward from a module of the stackable modules above or upward from the stackable module
below, the first IT area being configured as an IT input plenum,

a second IT area allowing the air to flow upward to the stackable module above or downward to the stackable module below,
the second IT area being configured as an IT output plenum;

a third IT area in between the first and second IT areas, the third IT area being fluidly isolated in relation to the third
IT areas of other modules of the stackable modules stacked above or below, the third IT area allowing a first vertical airflow
from the first IT area to at least partially transfer into a second vertical airflow of the second IT area, the third IT area
further comprising:

a row of heat producing computing cabinets adjacent to one of the IT input and output plenums;
a heat exchanger system for extracting the produced heat adjacent to another one of the IT input and output plenums; and
an aisle disposed between the row of heat producing computing cabinets and the heat exchanger system; and
an internal IT structure adapted to support a weight of at least one module of the stackable modules stacked above each of
the data center IT modules, the internal IT structure comprising a top IT portion and a bottom IT portion, the top IT portion
and the IT bottom portion being adapted to allow the first and second vertical airflows through each of the first and second
IT areas;

at least one stackable data center air-handling module, each of the stackable data center air-handling modules comprising:
a first air-handling area adapted to either allow the air to flow in an upward direction to a respective one of the stackable
data center IT modules above, or to allow the air to flow in a downward direction to the respective one of the stackable data
center IT modules below, the first air-handling area being configured as an air-handling output plenum;

a second air-handling area adapted to allow the air to flow in a downward direction from the respective one of the stackable
data center IT modules above, or to allow the air to flow in an upward direction from the respective one of the stackable
data center IT modules below, the second air-handling area being configured as an air-handling input plenum;

at least one blowing mechanism in between the first and second air-handling areas, the at least one blowing mechanism producing
a positive pressure effectively forcing the air to transfer from the second air-handling area into the first air-handling
area; and

an internal air-handling structure adapted to support a weight of at least one module of the stackable modules stacked above
each of the at least one data center air-handling module, the internal air-handling structure comprising a top air-handling
portion and a bottom air-handling portion, the top and bottom air-handling portions being adapted to allow vertical airflow
through each of the first and second air-handling areas,

wherein the first IT area and the first air-handling of each of the stackable modules within each of the at least one data
center slice are in direct fluid communication with one another, and

wherein the second IT area and the second air-handling area of each of the stackable modules within each of the at least one
data center slice are in direct fluid communication with one another.