US Patent No. 9,907,198

THREE-DIMENSIONAL SUBSTRATE FOR PROVIDING THREE-DIMENSIONAL STRUCTURE


Patent No. 9,907,198
Issue Date February 27, 2018
Title Three-dimensional Substrate For Providing Three-dimensional Structure
Inventorship Misako Tawarayama, Tokyo (JP)

Claim of US Patent No. 9,907,198

1. A three-dimensional substrate for connecting at least one electronic component, the three-dimensional substrate comprising:
a cord which is solidly formed; and
a connector which is solidly formed, wherein
the three-dimensional substrate forms a three-dimensional structure by three-dimensionally constituting the cord,
the connector is electrically connected with the electronic component or another connector,
the three-dimensional substrate is formed without using a printed substrate, and
the connector is formed by pins and lands.