US Patent No. 9,907,167


Patent No. 9,907,167
Issue Date February 27, 2018
Title Method For Manufacturing A Printed Circuit Board With High-capacity Copper Circuit
Inventorship Fang-Bo Xu, Shenzhen (CN)
Peng Wu, Shenzhen (CN)
Jian-Quan Shen, Shenzhen (CN)
Ke-Jian Wu, Shenzhen (CN)
Assignee Avary Holding (Shenzhen) Co., Limited., Shenzhen (CN) HongQiSheng Precisio...

Claim of US Patent No. 9,907,167

1. A method for manufacturing a printed board with high-capacity copper circuit comprising:
providing a single side cladding copper substrate, and the single side cladding copper substrate comprising a supporting sheet
and a base copper foil on the supporting sheet;

forming a first conductive trace pattern on a surface a surface of the base copper foil;
forming a first protecting layer on the first conductive trace pattern, and the first protecting layer being filled in first
gaps between the first conductive trace pattern;

removing the supporting sheet;
forming a second conductive trace pattern on another surfaces of the base copper foil, the second conductive trace pattern
and the base copper foil together form a plurality of second gaps;

etching the base copper foil exposed by the second gaps to form a base conductive trace pattern, the base conductive trace
pattern comprising a plurality of third gaps; and

laminating a second protecting layer on the second conductive trace pattern, the second protecting layer being filled in the
plurality of second gaps and the plurality of third gaps.