US Patent No. 9,883,615

SEMICONDUCTOR MEMORY DEVICE HAVING A HEAT CONDUCTION MEMBER


Patent No. 9,883,615
Issue Date January 30, 2018
Title Semiconductor Memory Device Having A Heat Conduction Member
Inventorship Kouei Yoshinaga, Tokyo (JP)
Assignee Toshiba Memory Corporation, Tokyo (JP)

Claim of US Patent No. 9,883,615

1. A semiconductor memory device, comprising:
a substrate having a conductive region on a surface thereof;
a semiconductor memory unit;
a memory controller, at least one of the semiconductor memory unit and the memory controller being disposed on the substrate;
a housing enclosing the substrate; and
a heat conduction member in contact with and pressed between the conductive region and a portion of the housing, wherein the
heat conduction member is made of an electrically-insulating material.