US Patent No. 9,883,598

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME


Patent No. 9,883,598
Issue Date January 30, 2018
Title Circuit Board And Method For Manufacturing The Same
Inventorship Yin-Ju Chen, Taoyuan (TW)
Ming-Hao Wu, Taoyuan (TW)
Cheng-Po Yu, Taoyuan (TW)
Assignee UNIMICRON TECHNOLOGY CORP., Taoyuan (TW)

Claim of US Patent No. 9,883,598

1. A method for a circuit board having a heat-recovery function, comprising:
forming at least one first via at a single-layer dielectric layer and disposing at least one first heat-conducting pillar
in the first via;

building up a plurality of buildup-dielectric layers from the single-layer dielectric layer to form a substrate;
respectively forming a first recess and a second recess on two opposite surfaces of the substrate, wherein the single-layer
dielectric layer is between the first recess and the second recess;

disposing a thermoelectric device into the first recess for embedding the thermoelectric device in the substrate, wherein
the thermoelectric device is connected to the first heat-conducting pillar;

forming at least one second via at a heat-storing device and filling the second via with at least one second heat-conducting
pillar such that the heat-storing device is penetrated by the second heat-conducting pillar;

disposing a processor on the heat-storing device, wherein the processor is connected to and in contact with the second heat-conducting
pillar; and

disposing the heat-storing device and the processor into the second recess for embedding the heat-storing device in the substrate,
wherein the heat-storing device is between the processor and the thermoelectric device.