US Patent No. 9,877,413


Patent No. 9,877,413
Issue Date January 23, 2018
Title Thermally Configured Connector System
Inventorship Kent E. Regnier, Lombard, IL (US)
Assignee Molex, LLC, Lisle, IL (US)

Claim of US Patent No. 9,877,413

1. A module comprising:
a body with a first opening;
an active component positioned within the body;
a first thermal dissipation system extending through the opening, the thermal dissipation system having a thermal transfer
area positioned outside a shell, the first thermal dissipation system thermally coupled to the active component and configured
to provide a thermal resistance of less than 3 C/W between the active component and the thermal transfer area, wherein the
shell has a first side and a second side opposing the first side, the first opening positioned on the first side, the shell
further including a second opening on the second side, wherein a second thermal dissipation system is positioned in the second
opening and the second thermal dissipation system is thermally coupled to an active component positioned within the body.