US Patent No. 9,860,985

SYSTEM AND METHOD FOR IMPROVING ISOLATION IN HIGH-DENSITY LAMINATED PRINTED CIRCUIT BOARDS


Patent No. 9,860,985
Issue Date January 02, 2018
Title System And Method For Improving Isolation In High-density Laminated Printed Circuit Boards
Inventorship Jack V. Ajoian, Philadelphia, PA (US)
Assignee Lockheed Martin Corporation, Bethesda, MD (US)

Claim of US Patent No. 9,860,985

1. A printed circuit board, comprising:
a plurality of dielectric layers including first, second and third dielectric layers;
a first metal layer arranged on the first dielectric layer, the first metal layer including a first signal conductor arranged
on a surface of the first dielectric layer;

a second metal layer arranged between the first dielectric layer and the second dielectric layer;
a second signal conductor arranged between the second dielectric layer and the third dielectric layer;
a via extending through at least a portion of the plurality of dielectric layers and electrically connecting a first end of
the first signal conductor to a first end of the second signal conductor;

a first ground via having a C-shaped profile at least partially surrounding the first end of the first signal conductor; and
a second ground via having a C-shaped profile at least partially surrounding the first end of the second signal conductor,
wherein the second ground via extends from the second metal layer through the third dielectric layer.