US Patent No. 9,860,975

THERMAL RELIEF PAD


Patent No. 9,860,975
Issue Date January 02, 2018
Title Thermal Relief Pad
Inventorship Mark Vinod Kapoor, Houston, TX (US)
David W. Engler, Cypress, TX (US)
Assignee Hewlett Packard Enterprise Development LP, Houston, TX (US)

Claim of US Patent No. 9,860,975

1. A printed circuit board (PCB) having a thermal relief pad around at least one via, the thermal relief pad comprising:
at least four thermal cut-outs; and
at least four conductive bands formed between the at least four thermal cut-outs, wherein:
the adjacent conductive bands from amongst the at least four conductive bands are orthogonal to each other and have unequal
lengths, and

each pair of mutually opposite conductive bands have substantially equal lengths;
wherein a length of a pair of mutually opposite conductive bands in a direction perpendicular to a direction of a return current
to at least one reference plane is greater than a length of a pair of mutually opposite conductive bands in a direction parallel
to the direction of the return current to the at least one reference plane.