US Patent No. 9,832,886

METHOD FOR FORMING WIRING


Patent No. 9,832,886
Issue Date November 28, 2017
Title Method For Forming Wiring
Inventorship Daisuke Kumaki, Yamagata (JP)
Shizuo Tokito, Yamagata (JP)
Yu Kobayashi, Yamagata (JP)
Shohei Norita, Yamagata (JP)
Assignee NATIONAL UNIVERSITY CORPORATION YAMAGATA UNIVERSITY, Yamagata (JP)

Claim of US Patent No. 9,832,886

1. A method for forming a wiring having a structure in which wiring elements between which an insulating resin layer is interposed
are connected via a contact hole, the method comprising:
applying a metal nanoparticle ink that exhibits electrical conductivity upon light absorption to a contact hole formation
portion of an upper face of the insulating resin layer formed on a lower wiring element; and

irradiating the metal nanoparticle ink with light to render metal nanoparticles included the metal nanoparticle ink conductive
and sintered by the irradiated light and also to remove a part of the insulating resin layer by heat emitted from the metal
nanoparticle ink so as to form the contact hole, the part of the insulating resin layer lying under the portion of the face
to which the metal nanoparticle ink is applied,

wherein when the contact hole is formed, a process in which the metal nanoparticles become sintered and conductive proceeds
in parallel with a process in which the part of the insulating resin layer melts, decomposes, and disappears by action of
heat.