US Patent No. 9,832,885

CIRCUIT BOARD, ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING CIRCUIT BOARD


Patent No. 9,832,885
Issue Date November 28, 2017
Title Circuit Board, Electronic Component And Method Of Manufacturing Circuit Board
Inventorship Myung Sam Kang, Suwon-Si (KR)
Ki Jung Sung, Suwon-Si (KR)
Seung Yeop Kook, Suwon-Si (KR)
Seung Eun Lee, Suwon-Si (KR)
Assignee Samsung Electro-Mechanics Co., Ltd., Suwon-si (KR)

Claim of US Patent No. 9,832,885

1. A circuit board comprising:
a first insulating layer;
a circuit pattern disposed on an upper surface of the first insulating layer and comprising a circuit patter portion and a
connection pad portion;

a second insulating layer made of a solder resist and formed on the first insulating layer and the circuit pattern so as to
cover the circuit pattern, the second insulating layer having an opening formed therein to expose at least a portion of the
connection pad portion; and

a contact pad formed on an upper surface of the second insulating layer and on an inner wall of the opening, one end of the
contact pad being in contact with the connection pad portion to be electrically connected to the connection pad portion.