US Patent No. 9,829,775

SEMICONDUCTOR ELEMENT COOLING STRUCTURE AND ELECTRONIC APPARATUS PROVIDED WITH SAME


Patent No. 9,829,775
Issue Date November 28, 2017
Title Semiconductor Element Cooling Structure And Electronic Apparatus Provided With Same
Inventorship Naoki Masuda, Tokyo (JP)
Assignee NEC DISPLAY SOLUTIONS, LTD., Tokyo (JP)

Claim of US Patent No. 9,829,775

1. A semiconductor element cooling structure for cooling a semiconductor element, comprising:
a heat receiving unit configured to receive heat emitted from the semiconductor element; and
a heat radiation unit configured to radiate the heat from the heat receiving unit,
wherein:
the heat receiving unit includes an element contact portion having a contact surface to which one surface of the semiconductor
element is fitted, and a heat diffusion portion that is contacted with the element contact portion and the heat radiation
unit;

the element contact portion includes a space portion;
the contact surface includes a through-hole which communicates with the space portion and through which a terminal of the
semiconductor element is inserted;

the space portion houses a substrate to which the terminal of the semiconductor element is connected; and
a thickness of the heat diffusion portion in a direction from the space portion to the heat radiation unit is in a range of
3 mm to 8 mm,

wherein the heat diffusion portion is disposed between the space portion and the heat radiation unit.