US Patent No. 9,806,050

METHOD OF FABRICATING PACKAGE STRUCTURE


Patent No. 9,806,050
Issue Date October 31, 2017
Title Method Of Fabricating Package Structure
Inventorship Pao-Hung Chou, Hsinchu County (TW)
Chih-Hao Hsu, Taoyuan (TW)
Assignee Unimicron Technology Corp., Taoyuan (TW)

Claim of US Patent No. 9,806,050

1. A method of fabricating a package structure having a semiconductor component embedded therein, comprising:
providing a core board having two opposing surfaces on which two carrier layers are formed;
forming on the carrier layers two metal layers having openings for exposing a part of surfaces of the carrier layers;
disposing on the carrier layers in the openings semiconductor chips having active surfaces and inactive surfaces opposing
the active surfaces, with electrode pads disposed on the active surfaces, the semiconductor chips combining with the carrier
layers in the openings by means of the inactive surfaces;

forming on the metal layers and the semiconductor chips first dielectric layers that have exposed first surfaces and second
surfaces combined with the metal layers;

forming first circuit layers on the first surfaces of the first dielectric layers, and forming in the first dielectric layers
a plurality of first conductive vias electrically connected to the first circuit layers and the electrode pads;

forming built-up structures on the first surfaces of the first dielectric layers and the first circuit layers;
forming insulating protective layers on the built-up structures, and forming in the insulating protective layers a plurality
of cavities for exposing a part of surfaces of the built-up structures; and

removing the core board, so as to expose the carrier layers.