US Patent No. 9,730,334

MOUNTING STRUCTURE OF LEADED ELECTRONIC COMPONENT WHICH REDUCES OCCURRENCE OF BLOW HOLE


Patent No. 9,730,334
Issue Date August 08, 2017
Title Mounting Structure Of Leaded Electronic Component Which Reduces Occurrence Of Blow Hole
Inventorship Makoto Bekke, Minamitsuru-gun (JP)
Takeshi Sawada, Minamitsuru-gun (JP)
Assignee FANUC Corporation, Minamitsuru-gun, Yamanashi (JP)

Claim of US Patent No. 9,730,334

1. A leaded electronic component mounting structure in which a leaded electronic component and a printed wiring board are
electrically and mechanically joined by inserting a lead of the leaded electronic component into a through hole provided in
the printed wiring board and performing immersing into molten solder, the leaded electronic component mounting structure comprising:
a surface mount component mounted on a surface mount component pad provided on the printed wiring board; and
the leaded electronic component placed over the surface mount component, wherein
the surface mount component and the surface mount component pad form a tunnel-shaped air passage connecting a space formed
by the leaded electronic component and the printed wiring board to an outside, and

the surface mount component prevents the tunnel-shaped air passage from coming into contact with the leaded electronic component.