US Patent No. 9,706,640

METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD


Patent No. 9,706,640
Issue Date July 11, 2017
Title Method For Manufacturing Printed Circuit Board
Inventorship Ming-Jaan Ho, New Taipei (TW)
Xian-Qin Hu, Shenzhen (CN)
Yi-Qiang Zhuang, Shenzhen (CN)
Fu-Wei Zhong, Shenzhen (CN)
Assignee FuKui Precision Component (Shenzhen) Co., Ltd., Shenzhen (CN) HongQiSheng ...

Claim of US Patent No. 9,706,640

1. A method for manufacturing a printed circuit board, comprising:
providing a first printed circuit substrate, the first printed circuit substrate comprising a substrate layer and a first
conductive circuit layer comprising at least one signal wire;

defining at least two first grooves in the substrate layer, any one of the at least two first grooves defined in one side
of the at least one signal wire;

providing a third copper;
defining a second groove in the third copper and then obtaining a second printed circuit substrate; and
bonding the second printed circuit substrate with the first printed circuit substrate, wherein the first groove is opposite
to the second groove, the first groove and the second groove forming a space, and the signal wire being surrounded by air
in the space.