US Patent No. 9,691,699

CIRCUIT STRUCTURE AND METHOD FOR MANUFACTURING THE SAME


Patent No. 9,691,699
Issue Date June 27, 2017
Title Circuit Structure And Method For Manufacturing The Same
Inventorship Chia-Chan Chang, Taipei (TW)
Gwo-Chaur Chen, Taoyuan (TW)
Yung-Tsai Chen, Taoyuan (TW)
Assignee Unimicron Technology Corp., Taoyuan (TW)

Claim of US Patent No. 9,691,699

1. A method for manufacturing a circuit structure, comprising:
forming two patterned circuit layers on a core layer, wherein the patterned circuit layers are located respectively on two
opposite surfaces of the core layer;

forming a patterned insulating layer respectively on each of the patterned circuit layers, wherein the patterned insulating
layers respectively expose a portion of the patterned circuit layers;

providing two support plates respectively bonded on the patterned insulating layers wherein each of the support plates, each
of the patterned insulating layers and each of the patterned circuit layers define a plurality of air gaps; and

after providing the two support plates, removing the core layer so as to expose an upper surface of each of the patterned
circuit layers and a top surface of each of the patterned insulating layers, wherein the upper surface of each of the patterned
circuit layers is aligned with the top surface of each of the patterned insulating layers.