1. A method for forming a segmented through hole in a printed circuit board using dual diameter through hole edge trimming,
drilling a first hole in the printed circuit board, the first hole having a first diameter;
drilling a second hole within the first hole, the second hole having a second diameter where the second diameter is larger
than the first diameter, and where a ledge is formed at a point between an end of the second hole and the first hole;
applying an electroless copper plating to an inner surface of the first hole and the second hole;
trimming material formed on the ledge of the segmented through hole when applying the copper plating; and
applying an electrolytic copper to the inner surface of the first hole and the second hole.