US Patent No. 9,661,748

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME


Patent No. 9,661,748
Issue Date May 23, 2017
Title Printed Circuit Board And Method Of Manufacturing The Same
Inventorship Norihiro Saidou, Yamanashi (JP)
Takeshi Sawada, Yamanashi (JP)
Assignee FANUC CORPORATION, Yamanashi (JP)

Claim of US Patent No. 9,661,748

1. A printed circuit board, comprising:
an insulating substrate;
a metal conductor formed on the insulating substrate;
a solder resist coating a part of the metal conductor, wherein the metal conductor has a scooped-out portion formed in a region
facing to an end of the solder resist; and

a solder layer coating and filled in the scooped-out portion.