1. A method for forming a patterned conductive structure, comprising:
forming a soluble layer on a surface of a substrate,
wherein the soluble layer has an opening exposing a rough portion of the surface of the substrate;
forming a first conductive layer on the soluble layer, wherein the first conductive layer extends onto the rough portion in
the opening; and
removing the soluble layer and the first conductive layer on the soluble layer, wherein a portion of the first conductive
layer corresponding to the rough portion is remained on the substrate.