US Patent No. 9,595,754

PATTERNED CONDUCTIVE STRUCTURE AND METHOD FOR FORMING THE SAME


Patent No. 9,595,754
Issue Date March 14, 2017
Title Patterned Conductive Structure And Method For Forming The Same
Inventorship Babak Radi, Hsinchu (TW)
Yong-Jyun Lu, Hsinchu (TW)
Ming-Chi Chiu, Hsinchu (TW)
Chien-Min Hsu, Hsinchu (TW)
Shih-Hong Chen, Hsinchu (TW)
Assignee Wistron NeWeb Corp., Hsinchu (TW)

Claim of US Patent No. 9,595,754

1. A method for forming a patterned conductive structure, comprising:
forming a soluble layer on a surface of a substrate,
wherein the soluble layer has an opening exposing a rough portion of the surface of the substrate;
forming a first conductive layer on the soluble layer, wherein the first conductive layer extends onto the rough portion in
the opening; and

removing the soluble layer and the first conductive layer on the soluble layer, wherein a portion of the first conductive
layer corresponding to the rough portion is remained on the substrate.