US Patent No. 9,554,487


Patent No. 9,554,487
Issue Date January 24, 2017
Title Microchannel Heat Transfer With Liquid Metals
Inventorship Andrew F. Glew, Hillsboro, OR (US)
Roderick A. Hyde, Redmond, WA (US)
Jordin T. Kare, Seattle, WA (US)
Lowell L. Wood, Jr., Bellevue, WA (US)
Assignee Elwha LLC, Bellevue, WA (US)

Claim of US Patent No. 9,554,487

1. An apparatus for controlling heat transfer between portions of a substrate comprising:
a substrate including at least part of a hydraulic circuit, the hydraulic circuit comprising a plurality of microconduits,
the plurality of microconduits including a first microconduit and a second microconduit;

a liquid metal flowing through the hydraulic circuit; and
a magnetic field source configured to provide a magnetic field to selectively direct the flow of the liquid metal between
the plurality of microconduits;

wherein the flow of the liquid metal through the hydraulic circuit transfers heat between a first portion of the substrate
and the liquid metal; and

wherein the magnetic field is activated to initiate the flow of the liquid metal in a desired direction and is inactivated
after the flow is initiated such that the flow of liquid metal continues in the desired direction through the hydraulic circuit
via surface tension.