US Patent No. 9,554,475

METHOD OF MANUFACTURING A FLEXIBLE ELECTRONICS MODULE


Patent No. 9,554,475
Issue Date January 24, 2017
Title Method Of Manufacturing A Flexible Electronics Module
Inventorship Jurgen H. Daniel, Washington, DC (US)
Assignee PALO ALTO RESEARCH CENTER INCORPORATED, Palo Alto, CA (US)

Claim of US Patent No. 9,554,475

1. A method of manufacturing a flexible electronics module, comprising:
mounting at least two functional components onto a flexible substrate having conductors;
forming stretchable electrical interconnects from stretchable conductive materials to provide connection between the at least
two functional components such that each functional component contacts at least one interconnect that connects to the other
function components;

perforating the flexible substrate in a first direction to increase stretchability of the flexible substrate in a second direction
after formation of the stretchable electrical interconnects to increase an ability to the flexible substrate to stretch and
flex, wherein perforations are arranged in the first direction to avoid the stretchable electrical interconnects to the functional
components, the functional components arranged to one of reside between the perforations or partially cover the perforations;
and

wherein the functional components have shapes that are at least partially conformal to shapes of the perforations in the substrate.