US Patent No. 9,536,798

PACKAGE STRUCTURE AND THE METHOD TO FABRICATE THEREOF


Patent No. 9,536,798
Issue Date January 03, 2017
Title Package Structure And The Method To Fabricate Thereof
Inventorship Bau-Ru Lu, Changhua County (TW)
Jeng-Jen Li, Taipei (TW)
Kun-Hong Shih, Hsinchu (TW)
Kaipeng Chiang, Taoyuan County (TW)
Assignee CYNTEC CO., LTD., Hsinchu (TW)

Claim of US Patent No. 9,536,798

1. A package structure, comprising:
a lead frame comprising a metal body and a plurality of pins insulated from each other,
wherein the metal body of the lead frame has a recess therein,
a substrate having conductive pattern layers therein;
a first conductive element having a top surface and a bottom surface, wherein a first plurality of I/O terminals are disposed
on the top surface of the first conductive element, wherein the first conductive element is disposed on the bottom surface
of the substrate with said first plurality of I/O terminals electrically connected to the substrate, wherein the substrate
is disposed over the lead frame and at least one portion of the first conductive element that includes the bottom surface
of the first conductive element is located in the recess of the lead frame; and the plurality of pins of the lead frame are
electrically connected to said first plurality of I/O terminals of the first conductive element via the conductive layers
of the substrate, wherein there is not any I/O terminal that is disposed on the bottom surface of the first conductive element
and electrically connected to the lead frame: and an insulating layer, disposed on the top surface of lead frame, wherein
said insulating layer is encompassed entirely between the outermost conductive layers of the substrate that are mounted on
the top surface of the lead frame when viewed from a plan view.