US Patent No. 9,526,173

ATTACHMENT FOR PREVENTING LIQUID FROM ADHERING TO ELECTRONIC COMPONENT


Patent No. 9,526,173
Issue Date December 20, 2016
Title Attachment For Preventing Liquid From Adhering To Electronic Component
Inventorship Norihiro Chou, Minamitsuru-gun (JP)
Kiichi Inaba, Minamitsuru-gun (JP)
Assignee FANUC Corporation, Minamitsuru-gun, Yamanashi (JP)

Claim of US Patent No. 9,526,173

1. An attachment for protecting an electronic component from liquid, the electronic component mounted on an electronic wiring
substrate of an electronic device and enclosed inside a casing with the electronic wiring substrate, the attachment comprising:
an attachment part that is configured to grip over a side edge of the electronic wiring substrate, the electronic wiring substrate
being a planar board with the electronic component mounted thereon, the attachment part located inside the casing, and is
detachably attached to the electronic wiring substrate; and

a shield part located inside the casing, the shield part being connected to or integrally formed with the attachment part,
the shield part being configured to shield the electronic component to be protected from a splash or droplet that is moving
toward the electronic component inside the casing, wherein

the shield part has an inclined surface which guides the splash or the droplet that is moving towards the electronic component
away from the electronic component once the splash or droplet engages with the shield part, so that the splash or the droplet
flows to a portion of the electronic device other than a location where the electronic component is located, and wherein

the attachment part includes two legs that are arranged one on each side of the electronic component and are also located
on a surface of the electronic wiring substrate where the electronic component is mounted.