US Patent No. 9,510,464

MANUFACTURING METHOD OF CIRCUIT BOARD


Patent No. 9,510,464
Issue Date November 29, 2016
Title Manufacturing Method Of Circuit Board
Inventorship Tzyy-Jang Tseng, Hsinchu (TW)
Shu-Sheng Chiang, Taipei (TW)
Tsung-Yuan Chen, Taoyuan County (TW)
Assignee Unimicron Technology Corp., Taoyuan (TW)

Claim of US Patent No. 9,510,464

1. A manufacturing method of a circuit board, comprising:
providing a circuit substrate having a first surface and at least a first circuit;
forming a dielectric layer on the circuit substrate, the dielectric layer having a second surface and covering the first surface
and the at least a first circuit;

irradiating the dielectric layer by a laser beam to form a first intaglio pattern, a second intaglio pattern, and at least
a blind via extending from the second surface of the dielectric layer to the at least a first circuit of the circuit substrate;

forming a first conductive layer in the first intaglio pattern, the second intaglio pattern, and the at least a blind via,
wherein the first conductive layer fills the first intaglio pattern and is disposed on an inner wall of the second intaglio
pattern and an inner wall of the at least a blind via, and an entire volume of the first intaglio pattern is full of the first
conductive layer;

forming a barrier layer in the second intaglio pattern and the at least a blind via, the barrier layer covering the first
conductive layer;

forming a second conductive layer in the second intaglio pattern and the at least a blind via, the second conductive layer
covering the barrier layer; and

removing parts of the second conductive layer, parts of the barrier layer, and parts of the first conductive layer until the
second surface of the dielectric layer is exposed to form a patterned circuit structure, the patterned circuit structure being
located in the first intaglio pattern, the second intaglio pattern, and the at least a blind via and being electrically connected
to the at least a first circuit of the circuit substrate.