US Patent No. 9,449,137

BUFFERED CONDUITS FOR HIGH THROUGHPUT CHANNEL IMPLEMENTATION, CROSSTALK DE-SENSITIZATION AND LATE TIMING FIXES ON SKEW SENSITIVE BUSES


Patent No. 9,449,137
Issue Date September 20, 2016
Title Buffered Conduits For High Throughput Channel Implementation, Crosstalk De-sensitization And Late Timing Fixes On Skew Sensitive Buses
Inventorship Raashid Moin Shaikh, Bangalore (IN)
Vishnuraj Arukat Rajan, Kerala (IN)
Assignee TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)

Claim of US Patent No. 9,449,137

1. A method of manufacturing a system on a chip comprising the steps of:
selecting a set of pre-designed modules for the system on a chip;
placing said selected modules on a semiconductor; and
connecting said set of pre-designed modules via a plurality of buses formed according to a set of design rules specifying
tracks having a minimum size of conductors and a minimum spacing between conductors, said connecting including

routing each bus on a preferred direction,
placing minimum size conductors of a first set of alternating conductors of each bus at twice the minimum spacing within corresponding
first tracks of a selected metal layer of the semiconductor,

placing minimum size conductors of a second set of alternating conductors of each bus at twice the minimum spacing within
corresponding second tracks of a metal layer different than said selected metal layer,

connecting the alternating track conductors to corresponding conductors in said selected metal layer by vias.