1. A printed circuit board on which a component having a plurality of terminals is to be mounted by using a reflow soldering
wiring patterns that are arranged in correspondence with the plurality of terminals of the component and have a size which
is smaller in wiring patterns for terminals near a central portion of the component than in wiring patterns for terminals
near each end portion of the component,
wherein the wiring patterns for the terminals near each end portion of the component respectively have a larger dimension
in a direction perpendicular to a pitch direction than that of the wiring patterns for the terminals near the central portion
of the component.