US Patent No. 9,312,618

CONNECTOR WITH TUNED CHANNEL


Patent No. 9,312,618
Issue Date April 12, 2016
Title Connector With Tuned Channel
Inventorship Kent E. Regnier, Lombard, IL (US)
Patrick R. Casher, North Aurora, IL (US)
Assignee Molex, LLC, Lisl, IL (US)

Claim of US Patent No. 9,312,618

1. A connector, comprising:
a housing having a card slot;
a first and second signal wafer inserted into the housing, the first wafer having a first terminal supported by a first insulative
frame and the second wafer having a second terminal supported by the insulative frame, the first and second terminal each
having a tail, a contact and a body extending between the tail and the contact, the first and second terminals configured
to provide a broad-side differentially coupled transmission channel that extends substantially through the insulative frames,
where the differential coupling mode is in a horizontal arrangement from the contact portion through the body portion;

a third wafer positioned adjacent the first wafer, the third wafer having an insulative frame that supports a third terminal,
the third terminal extending along the channel and substantially aligned with the first terminal;

a fourth wafer positioned adjacent the second wafer, the fourth wafer having an insulative frame that supports a fourth terminal,
the fourth terminal extending along the channel and substantially aligned with the second terminal;

wherein each of the first, second, third and fourth terminal have a truss of the respective insulative frame that secures
upper and lower edges of the terminal, the truss having a corresponding first and second side that provide a corresponding
predefined thickness, the thickness defined by a slot on a first side and a slot or edge of the frame on a second side; and

a first and second terminal groove extending along both sides of the respective terminal of each of the third and fourth insulative
frame, the first and second terminal groove defining an air channel on both sides of the third and fourth terminal, wherein
coupling between the terminals of the first and third wafer is less than coupling between the terminals of the first and second
wafer.