US Patent No. 9,288,917

MANUFACTURING METHOD FOR MULTI-LAYER CIRCUIT BOARD


Patent No. 9,288,917
Issue Date March 15, 2016
Title Manufacturing Method For Multi-layer Circuit Board
Inventorship Pei-Chang Huang, Taoyuan County (TW)
Cheng-Po Yu, Taoyuan County (TW)
Han-Pei Huang, Taoyuan County (TW)
Assignee Unimicron Technology Corp., Taoyuan (TW)

Claim of US Patent No. 9,288,917

1. A method for manufacturing a multi-layer circuit board, comprising:
providing a substrate, the substrate comprising two surfaces opposite to each other and a first via connecting the surfaces;
forming a first patterned circuit layer on each of the surfaces by using the first via as an alignment target, wherein each
of the first patterned circuit layers comprises a first concentric-circle pattern surrounding the first via;

forming a first stacking layer on each of the surfaces, the first stacking layer comprising a first dielectric layer and a
first circuit layer covering the first dielectric layer;

forming a first through hole, the first through hole penetrating regions of the first stacking layers and the substrate where
an inner diameter of a first concentric circle from a center of the first concentric-circle pattern is orthogonally projected
on;

forming a second stacking layer on each of the first stacking layers, each of the second stacking layers comprising a second
dielectric layer and a second circuit layer covering the second dielectric layer; and

forming a second through hole penetrating regions of the second stacking layers, the first stacking layers, and the substrate
where an inner diameter of a second concentric circle from the center of the first concentric-circle pattern is orthogonally
projected.