US Patent No. 9,253,926

SERVO AMPLIFIER HAVING COOLING STRUCTURE INCLUDING HEAT SINK


Patent No. 9,253,926
Issue Date February 02, 2016 
Title Servo Amplifier Having Cooling Structure Including Heat Sink
Inventorship Kenichi Okuaki, Yamanashi (JP)
Assignee Fanuc Corporation, Yamanashi (JP)

Claim of US Patent No. 9,253,926

1. A servo amplifier comprising:
a housing;
a heat source arranged in the housing; and
a heat dissipating structure comprising a heat sink arranged in the housing and thermally connected to the heat source,
wherein the heat source is mounted on a printed board which is attached to the housing via a protrusion formed on an inner
face of the housing,

wherein the heat sink comprises heat dissipating fins extending from at least a portion of a surface of the heat sink, other
than a second connecting face which is thermally connected to the heat source, and

wherein a first connecting face of the heat sink different from the second connecting face is thermally connected to an inner
face of the housing,

wherein one of the heat dissipating fins having the first connecting face has a thickness larger than the other heat dissipating
fins.