US Patent No. 9,253,898


Patent No. 9,253,898
Issue Date February 02, 2016 
Title Rigid Flex Board Module And The Manufacturing Method Thereof
Inventorship Chi-Shiang Chen, New Taipei (TW)
Hsiu-Ching Hu, Taoyuan County (TW)
Kun-Wu Li, Hsinchu County (TW)
Fang-Ping Wu, Taoyuan County (TW)
Assignee Unimicron Technology Corp., Taoyuan Hsien (TW)

Claim of US Patent No. 9,253,898

1. A rigid flex board module, comprising:
a rigid flex circuit board, comprising:
a flexible circuit board including a bending portion and a jointing portion connected to the bending portion;
a first rigid circuit board disposed on the jointing portion and exposing the bending portion, and the first rigid circuit
board electrically connected to the flexible circuit board; and

a first adhesive layer connected between the first rigid circuit board and the jointing portion;
a high-density interconnected circuit board arranged in and electrically connected to the first rigid circuit board, wherein
the total number of layers of high-density interconnected circuit board is larger than the total number of layers of the flexible
circuit board;

at least one pair of multi-layer circuit layers respectively configured at two sides of the rigid flex circuit board and two
sides of the high-density interconnected circuit board; and

a plurality of conductive posts electrically connected to the pair of multi-layer circuit layers, the high-density interconnected
circuit board, and the first rigid circuit board.