US Patent No. 9,253,898

RIGID FLEX BOARD MODULE AND THE MANUFACTURING METHOD THEREOF


Patent No. 9,253,898
Issue Date February 02, 2016 
Title Rigid Flex Board Module And The Manufacturing Method Thereof
Inventorship Chi-Shiang Chen, New Taipei (TW)
Hsiu-Ching Hu, Taoyuan County (TW)
Kun-Wu Li, Hsinchu County (TW)
Fang-Ping Wu, Taoyuan County (TW)
Assignee Unimicron Technology Corp., Taoyuan Hsien (TW)

Claim of US Patent No. 9,253,898

1. A rigid flex board module, comprising:
a rigid flex circuit board, comprising:
a flexible circuit board including a bending portion and a jointing portion connected to the bending portion;
a first rigid circuit board disposed on the jointing portion and exposing the bending portion, and the first rigid circuit
board electrically connected to the flexible circuit board; and

a first adhesive layer connected between the first rigid circuit board and the jointing portion;
a high-density interconnected circuit board arranged in and electrically connected to the first rigid circuit board, wherein
the total number of layers of high-density interconnected circuit board is larger than the total number of layers of the flexible
circuit board;

at least one pair of multi-layer circuit layers respectively configured at two sides of the rigid flex circuit board and two
sides of the high-density interconnected circuit board; and

a plurality of conductive posts electrically connected to the pair of multi-layer circuit layers, the high-density interconnected
circuit board, and the first rigid circuit board.