US Patent No. 9,246,251

HIGH DENSITY CONNECTOR


Patent No. 9,246,251
Issue Date January 26, 2016 
Title High Density Connector
Inventorship Kent E. Regnier, Lombard, IL (US)
Patrick R. Casher, North Aurora, IL (US)
Michael Rowlands, Naperville, IL (US)
Assignee Molex, LLC, Lisle, IL (US)

Claim of US Patent No. 9,246,251

1. A connector, comprising:
a housing have a card slot;
a first wafer having a first and second ground terminal, the first and second ground terminals having, respectively, a first
and second contact positioned on opposite sides of the card slot, the first wafer having a bar electrically connecting the
first and second ground terminal, the bar including a plurality of first junctions;

a second wafer having a first signal terminal and a second signal terminal, the second wafer supporting a plurality of tail
stubs, the signal terminals each having a contact, a signal tail and a body extending therebetween, the contacts of the first
and second signal terminals positioned on opposite sides of the card slot and the plurality of tail stubs each having a second
junction and a ground tail;

a third wafer having a third signal terminal and a fourth signal terminal, the third and fourth signal terminals each having
a contact, a signal tail and a body extending therebetween, the contacts of the third and fourth signal terminals positioned
on opposite sides of the card slot, the first terminal of the second wafer and the third terminal of the third wafer forming
a first broad-side coupled differential pair and the second terminal of the second wafer and the fourth terminal of the third
wafer forming a second broad-side coupled differential pair; and

a plurality of conductive members electrically connecting the first junctions with the second junctions.