US Patent No. 9,230,899

PACKAGING SUBSTRATE HAVING A HOLDER, METHOD OF FABRICATING THE PACKAGING SUBSTRATE, PACKAGE STRUCTURE HAVING A HOLDER, AND METHOD OF FABRICATING THE PACKAGE STRUCTURE


Patent No. 9,230,899
Issue Date January 05, 2016 
Title Packaging Substrate Having A Holder, Method Of Fabricating The Packaging Substrate, Package Structure Having A Holder, And Method Of Fabricating The Package Structure
Inventorship Wen-Lung Lai, Taoyuan (TW)
Yuan-Liang Lo, Taoyuan (TW)
Assignee Unimicron Technology Corporation, Taoyuan (TW)

Claim of US Patent No. 9,230,899

1. A packaging substrate, comprising:
a holder including an insulating layer, copper layers formed on opposite sides of the insulating layer, a dielectric layer
formed on one of the copper layers, a first metal stripping layer formed on the dielectric layer, and a second metal stripping
layer attached to the first metal stripping layer, wherein the first metal stripping layer and the second metal stripping
layer are full-sheeted and separable from each other;

a plurality of first conductive pads formed on the second metal stripping layer;
a core layer formed on the second metal stripping layer and the first conductive pads and having a first surface and a second
surface opposite to the first surface, wherein the first conductive pads are embedded in the first surface of the core layer;

a circuit layer formed on the second surface of the core layer and having a plurality of conductive vias formed in the core
layer and electrically connected to the first conductive pads, the circuit layer having a plurality of second conductive pads;
and

an insulating protection layer formed on and being in direct contact with the second surface of the core layer and the circuit
layer and having a plurality of openings, from which the second conductive pads are correspondingly exposed.