US Patent No. 9,230,852

INTEGRATED CIRCUIT (IC) HAVING ELECTRICALLY CONDUCTIVE CORROSION PROTECTING CAP OVER BOND PADS


Patent No. 9,230,852
Issue Date January 05, 2016 
Title Integrated Circuit (ic) Having Electrically Conductive Corrosion Protecting Cap Over Bond Pads
Inventorship Helmut Rinck, Moosburg (DE)
Fromund Metz, Marzling (DE)
Jan Hermann Pape, Freising (DE)
Janet Riley, Hideaway, TX (US)
Assignee TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)

Claim of US Patent No. 9,230,852

1. An integrated circuit (IC) die, comprising:
a substrate having a top side surface providing circuitry including active circuitry configured to provide a function, having
at least one bond pad comprising a bond pad metal coupled to a node in said circuitry, and a dielectric passivation layer
over said top side surface providing a contact area which exposes said bond pad, and

a metal capping layer and having a first portion over at least said contact area in electrical contact with said bond pad
metal and a second portion over the dielectric passivation layer not in electrical contact with any bond pad metal.