1. An integrated circuit (IC) die, comprising:
a substrate having a top side surface providing circuitry including active circuitry configured to provide a function, having
at least one bond pad comprising a bond pad metal coupled to a node in said circuitry, and a dielectric passivation layer
over said top side surface providing a contact area which exposes said bond pad, and
a metal capping layer and having a first portion over at least said contact area in electrical contact with said bond pad
metal and a second portion over the dielectric passivation layer not in electrical contact with any bond pad metal.