US Patent No. 9,204,080

MULTI-CHIP MODULES HAVING STACKED TELEVISION DEMODULATORS


Patent No. 9,204,080
Issue Date December 01, 2015
Title Multi-chip Modules Having Stacked Television Demodulators
Inventorship Vitor Pereira, Austin, TX (US)
Ramin Khoini-Poorfard, Austin, TX (US)
Eric Mauger, Liffre (FR)
Assignee Silicon Laboratories Inc., Austin, TX (US)

Claim of US Patent No. 9,204,080

1. A multi-chip module (MCM) package having multiple television demodulator dies, comprising:
a plurality of pins, the pins comprising:
a plurality of input pins configured to receive two or more tuned broadcast channels associated with at least one of satellite
television broadcasts;

a plurality of input pins configured to receive two or more tuned broadcast channels associated with terrestrial or cable
television broadcasts; and

a plurality of output pins configured to provide two or more demodulated television signals;
at least two stacked demodulator dies coupled to the plurality of pins, each die having at least one pad connected to a shared
pin for the MCM package and each die being configured to provide at least one of the demodulated television signals;

wherein the MCM package has a top surface area of about 64 square millimeters or less.