1. A multi-chip module (MCM) package having multiple television demodulator dies, comprising:
a plurality of pins, the pins comprising:
a plurality of input pins configured to receive two or more tuned broadcast channels associated with at least one of satellite
television broadcasts;

a plurality of input pins configured to receive two or more tuned broadcast channels associated with terrestrial or cable
television broadcasts; and

a plurality of output pins configured to provide two or more demodulated television signals;
at least two stacked demodulator dies coupled to the plurality of pins, each die having at least one pad connected to a shared
pin for the MCM package and each die being configured to provide at least one of the demodulated television signals;

wherein the MCM package has a top surface area of about 64 square millimeters or less.