US Patent No. 9,203,340

TEMPERATURE ESTIMATION DEVICE ESTIMATING TEMPERATURE OF POWER SEMICONDUCTOR CHIP, AND MOTOR CONTROL DEVICE INCLUDING THE SAME


Patent No. 9,203,340
Issue Date December 01, 2015
Title Temperature Estimation Device Estimating Temperature Of Power Semiconductor Chip, And Motor Control Device Including The Same
Inventorship Ryouta Yamaguchi, Yamanashi (JP)
Assignee FANUC CORPORATION, Yamanashi (JP)

Claim of US Patent No. 9,203,340

1. A temperature estimation device estimating a temperature of one power semiconductor chip that is a temperature estimating
target and that is included in one or more power semiconductor chips contained in one power semiconductor module out of power
semiconductor modules whose number is equal to or larger than the number of a plurality of motors and that are arranged in
the same heat radiator for driving the plurality of motors, respectively, the temperature estimation device comprising:
a first electric power loss calculation unit calculating a first electric power loss corresponding to an electric power loss
generated in all power semiconductor chips of the power semiconductor module containing the one power semiconductor chip that
is the temperature estimating target;

a first temperature difference calculation unit calculating, on the basis of the first electric power loss, a first temperature
difference corresponding to a temperature difference between the heat radiator and the power semiconductor module containing
the one power semiconductor chip that is the temperature estimating target;

a second temperature difference calculation unit calculating, on the basis of the first electric power loss and a second electric
power loss, a second temperature difference corresponding to a temperature difference between the heat radiator and a reference
temperature, the second electric power loss corresponding to an electric power loss generated in all power semiconductor chips
of one or more power semiconductor modules other than the power semiconductor module containing the one power semiconductor
chip that is the temperature estimating target;

a temperature calculation unit calculating a temperature of the one power semiconductor chip that is the temperature estimating
target, on the basis of the reference temperature, the first temperature difference, and the second temperature difference;
and

a temperature output unit outputting the temperature calculated by the temperature calculation unit.