US Patent No. 9,198,303

MANUFACTURING METHOD FOR MULTI-LAYER CIRCUIT BOARD


Patent No. 9,198,303
Issue Date November 24, 2015
Title Manufacturing Method For Multi-layer Circuit Board
Inventorship Pei-Chang Huang, Taoyuan County (TW)
Cheng-Po Yu, Taoyuan County (TW)
Han-Pei Huang, Taoyuan County (TW)
Ai-Hwa Lim, New Taipei (TW)
Assignee Unimicron Technology Corp., Taoyuan (TW)

Claim of US Patent No. 9,198,303

1. A manufacturing method for a multi-layer circuit board, comprising:
compressing two core layers to form a substrate having two surfaces opposite to each other;
forming a first via connecting through the two surfaces;
forming a first patterned circuit layer on each of the two surfaces by using the first via as an alignment target, and the
first patterned circuit layer including a first concentric-circle pattern surrounding the first via;

forming a first stacking layer on each of the two surfaces, and the first stacking layer including a first dielectric layer
and a first circuit layer covering the first dielectric layer;

forming a first through hole, and the first through hole penetrating regions where an inner diameter of a first concentric
circle from a center of the first concentric-circle pattern is orthogonally projected on the first stacking layers and the
substrate;

forming a second stacking layer on each of the first stacking layers, and the second stacking layer including a second dielectric
layer and a second circuit layer covering the second dielectric layer; and

forming a second through hole, and the second through hole penetrating regions where an inner diameter of a second concentric
circle from the center of the first concentric-circle pattern is orthogonally projected on the second stacking layers, the
first stacking layers and the substrate.