US Patent No. 9,143,114

BONDING TYPE CRYSTAL CONTROLLED OSCILLATOR


Patent No. 9,143,114
Issue Date September 22, 2015
Title Bonding Type Crystal Controlled Oscillator
Inventorship Hidenori Harima, Saitama (JP)
Assignee NIHON DEMPA KOGYO CO., LTD., Tokyo (JP)

Claim of US Patent No. 9,143,114

1. A bonding type crystal controlled oscillator, comprising:
a crystal package that houses a crystal oscillator; and
a circuit package that houses an electronic circuit component constituting an oscillation circuit with the crystal oscillator,
the circuit package and the crystal package being bonded by two-tier bonding, wherein

the crystal package includes a container that has a back surface facing the circuit package and includes a plurality of output
terminals with a flat shape, the plurality of output terminals forming one step higher than the back surface,

the circuit package includes an upper surface facing the crystal package and a plurality of external terminals with a flat
shape disposed at positions corresponding to the plurality of output terminals formed on the crystal package, the plurality
of external terminals forming one step higher than the upper surface,

an anisotropy conductive adhesive is interposed between the back surface of the crystal package facing the circuit package
and the upper surface of the circuit package facing the crystal package, the anisotropy conductive adhesive including a thermosetting
resin containing solder micro particles dispersed in the thermosetting resin, and

assuming that a thickness of the output terminal formed at the crystal package is C ?m, a thickness of the external terminal
formed at the circuit package is D ?m, and an average outside diameter of the solder micro particles dispersed in the anisotropy
conductive adhesive is E ?m, the dimensional relation is set to (C+D)>E,

wherein assuming that:
a deflection amount between surfaces of the output terminals toward a direction away from the external terminal of the circuit
package is denoted as A (A?0), the plurality of the output terminals with a flat shape being disposed on the back surface
of the container of the crystal package; and

a deflection amount between surfaces of the external terminals toward a direction away from the output terminal of the crystal
package is denoted as B (B?0), the plurality of the external terminals with a flat shape being disposed on the upper surface
of the container of the circuit package,

the crystal package and the circuit package that satisfy a sum of (A+B)?20 ?m are used to be bonded.