1. A circuit, comprising:
an integrated circuit (IC) package that includes an interposer having an outline portion that is notched with each notch at
least partially plated to form conductive components within the notches;
a printed circuit board (PCB) substrate formed with an opening portion that is dimensioned to accommodate the IC package;
wherein when the IC package is disposed in the opening portion and is electrically coupled to the PCB substrate for PCB assembling,
a thickness of the assembled PCB is less than a thickness sum of the IC package and the PCB substrate.