US Patent No. 11,116,115

HIGH POWER DENSITY POWER SUPPLY


Patent No. 11,116,115
Issue Date September 07, 2021
Title High Power Density Power Supply
Inventorship Mu-Chun Lin, Taichung (TW)
Assignee CHYNG HONG ELECTRONIC CO., LTD., Taichung (TW)

Claim of US Patent No. 11,116,115


1. A high power density power supply, comprising a casing, the casing being covered with an upper cover, at least one power module being provided in the casing, a cooling fan being provided in front of the power module, a first filter circuit board being provided below the cooling fan, a second filter circuit board being provided in reverse above the cooling fan so that a back of the second filter circuit board faces up, characterized in that: the high power density power supply further comprises a plurality of buffer pads and an insulating plate; the buffer pads are disposed on the back of the second filter circuit board, respectively; the insulating plate is disposed on the buffer pads, the insulating plate completely covers a top of the second filter circuit board, through the buffer pads, a distance is defined between the insulating plate and the second filter circuit board, wherein an insulating sheet is provided between the insulating plate and the second filter circuit board and located above the cooling fan, the second filter circuit board, the insulating sheet and the insulating plate are locked to the cooling fan by a plurality of bolts.