US Patent No. 11,116,113

COOLING ELECTRONIC DEVICES IN A DATA CENTER


Patent No. 11,116,113
Issue Date September 07, 2021
Title Cooling Electronic Devices In A Data Center
Inventorship Jerry Chiu, Pacifica, CA (US)
Abolfazl Sadeghpour, Los Angeles, CA (US)
Gregory P. Imwalle, Mountain View, CA (US)
Assignee Google LLC, Mountain View, CA (US)

Claim of US Patent No. 11,116,113


1. A data center cooling system, comprising:an outer container that defines a first volume;
an inner container that defines a second volume and is positioned within the first volume, the inner container comprising an air outlet that comprises an airflow path between the first and second volumes;
a liquid seal to fluidly isolate a liquid phase of a non-conductive coolant that fills at least a portion of the first and second volumes from an ambient environment;
at least one server tray assembly comprising:a plurality of electronic heat-generating devices immersed in the liquid phase of the non-conductive coolant; and
an immersion cooling system mounted to and in conductive thermal contact with one or more of the plurality of electronic heat-generating devices, the immersion cooling system comprising: a working fluid in thermal communication with the one or more electronic heat-generating devices and the non-conductive coolant, a vapor chamber mounted to and in conductive thermal contact with the one or more electronic heat-generating devices, and one or more heat transfer devices positioned in thermal contact with the working fluid within an inner volume of the vapor chamber and in thermal contact with a liquid phase of the non-conductive coolant.