US Patent No. 11,116,103

MULTI-FLOOR DATA CENTER COOLING SYSTEM


Patent No. 11,116,103
Issue Date September 07, 2021
Title Multi-floor Data Center Cooling System
Inventorship Tianyi Gao, San Jose, CA (US)
Assignee BAIDU USA LLC, Sunnyvale, CA (US)

Claim of US Patent No. 11,116,103


1. A multi-floor data center comprising:a data center building having a plurality of floors;
a single air intake module spanning each of the plurality of floors and configured to receive external air into the data center building;
a plurality of cooling coil modules, wherein each of the plurality of floors includes at least one of the plurality of cooling coil modules configured to receive the external air from the single air intake module to cool a cooling coil;
a centralized liquid cooling system configured to circulate cooling liquid to the cooling coil for each of the plurality of cooling coil modules; and
a plurality of IT modules, wherein each of the plurality of floors includes one of the IT modules configured to house a plurality of computing systems, wherein internal air is cooled at each of the plurality of cooling coil modules and introduced into each of the plurality of IT modules.